26th – 29th May 2015, Kursaal Congress Center, Donostia-San Sebastian, Spain.
www.icae2015.com

The event, which is held every 3 years, is organised by TECNALIA Research & Innovation. The main topic of the Congress will be related to 'Smartization' on the introduction of new technologies in Architectural Envelopes. Lorenzo Miccoli (BAM) will give a presentation on the composite UHPC-AAC/CLC façade elements with modified interior plaster.

During three days, the Congress will become the meeting point to know the latest trends, products, solutions and market achievements thanks to the contribution of more than 70 acknowledged lecturers.

The main topic for this edition will be the integration of new technologies to achieve smart facades and adaptable envelopes. ICAE2015 is organised by TECNALIA Research & Innovation, the company offers a comprehensive relationship as technology partner for the industry on development, characterisation and performance assessment of architectural envelopes.